Published Researchs

An artificial intelligence-based approach for identifying the in-plane orthotropic mechanical properties of electronic circuit boardsThe Journal of Strain Analysis for Engineering DesignMechanics of Materials, Artificial Intelligence Applications2024  Visit URL
A Study on the Fuel Consumption Demands of the Jordanian Residential SectorJordan Journal of Mechanical and Industrial EngineeringEnergy demand analysis2024  Visit URL
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bondsMicroelectronics ReliabilityCreep mechanics, solid mechanics, stress analysis2024  Visit URL
Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testingSoldering & Surface Mount Technology,Solid Mechanics, Stress and Strain Analysis2024  Visit URL
Analysis and future projections of the electricity demands of the Jordanian household sector using artificial neural networksJournal of Science and Technology Policy ManagementSustainability, Artificial Intelligence and Energy Analysis2024  Visit URL
Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive ModelsIEEE Transactions on Components, Packaging and Manufacturing TechnologyCreep mechanics, solid mechanics, stress analysis2023  Visit URL
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contentsSoldering & Surface Mount TechnologySolid Mechanics, Materials Science2023  Visit URL
Numerical Characterization of the Mechanical Performance of SAC105 Tin-Silver-Copper Solder Interconnections After AgingAnnales de Chimie - Science des MatériauxSolid Mechanics, Thermal Stresses2023  Visit URL
Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free soldersProceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and ApplicationsSolid Mechanics, Thermal Stresses2023  Visit URL
Investigating and Predicting the Effects of Fiber Chemical Composition and Treatment on the Mechanical Properties of Natural Fiber Composites by Response Surface MethodMathematical Modelling of Engineering ProblemsComposite Materials, Solid Mechanics2023  Visit URL
Drop and impact reliability investigation of BGA and LGA interconnectsSoldering & Surface Mount Technology,Solid Mechanics, Stress and Strain Analysis2023  Visit URL
Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronicsThe Journal of Strain Analysis for Engineering DesignMaterials Science, Creep of Metals, Solid Mechanics2023  Visit URL
Analytical Evaluation of Solder Stress in Electronic Packages Subjected to Random VibrationsMathematical Modelling of Engineering ProblemsRandom Vibrations, Solid Mechanics2023  Visit URL
An efficient equivalent static methodology for simulating electronic packages subjected to resonant vibrationsMicroelectronics ReliabilitySolid Mechanics, Stress Analysis, Vibrations2023  Visit URL
A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibrationMicroelectronics InternationalVibrations, Stress Analysis, Electronic Assemblies2023  Visit URL
Numerical Solution for Electronic Assemblies Subjected to Mechanical BendingMathematical Modelling of Engineering ProblemsSolid Mechanics, Stress Analysis, Numerical Approach2022  Visit URL
A methodology to calculate the equivalent static loading for simulating electronic assemblies under impactMicroelectronics ReliabilitySolid Mechanics, Mechanical Vibrations and Impact Loading2022  Visit URL
Numerical Solution for the Mechanical Bending of Two Elastically Coupled Plates ProblemMathematical Modelling of Engineering ProblemsStress and Strain Analysis, Solid Mechanics2022  Visit URL
An Accuracy and Efficiency Study on the Use of Symmetrical Numerical Models of Electronic Packages under Various Loading ConditionsJordan Journal of Mechanical and Industrial EngineeringComputational Mechanics2022  Visit URL
A High-Accuracy Empirical Formula for the Strain Concentration Factor in Countersunk HolesMathematical Modelling of Engineering ProblemsStress and Strain Analysis, Solid Mechanics2022  Visit URL
Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study Journal of the Mechanical Behavior of MaterialsSolid Mechanics, and Mechanics of Materials2022  Visit URL
A simulation-based study on the effect of package parameters on the random vibration behavior of electronic packagesThe European Physical Journal PlusSolid Mechanics, and Random Vibrations2021  Visit URL
Identification of printed circuit boards mechanical properties using response surface methodsMicroelectronics InternationalMechanics, Material Characterization, Measurements2021  Visit URL
A numerical analysis on the effect of point-support methods on the fatigue performance of thermally cycled electronic assembliesMicroelectronics ReliabilitySolid Mechanics, Thermal Stresses2021  Visit URL
Finite Element Analysis on the Thermal Fatigue Life of Full vs. Peripheral Array PackagesMultidiscipline Modeling in Materials and StructuresSolid Mechanics, Stress and Strain Analysis2021  Visit URL
Optimization of Dwell and Ramp Times for SAC305 Solder Thermal Cycling Fatigue Life for Testing and Real-Life ApplicationsJournal of Failure Analysis and PreventionSolid Mechanics, Stress Analysis2021  Visit URL
Stress concentration factor analysis of countersunk holes using finite element analysis and response surface methodologyAustralian Journal of Mechanical EngineeringStress Concentrations, Finite Element Method, Solid Mechanics2021  Visit URL
A Study on the Stress Concentration Factor Induced in Double Countersunk Holes Due to Uniaxial TensionInternational Journal of Applied Mechanics and EngineeringSolid Mechanics, Stress and Strain Analysis2020  Visit URL
Analysis, formulation, and optimisation of the strain concentration factor in double countersunk holes due to uniaxial tensionAustralian Journal of Mechanical EngineeringApplied Mechanics, Finite Element Analysis2020  Visit URL
Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadingsSoldering & Surface Mount TechnologyMaterial Failure, Solid Mechanics, Shock and Vibration2020  Visit URL
A numerical study on the effect of the fixation methods on the vibration fatigue of electronic packagesMicroelectronics ReliabilitySolid Mechanics, Shock and Vibration2020  Visit URL
Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi methodMicroelectronics ReliabilitySolid Mechanics, Random Vibration2019  Visit URL
Three-Material Beam: Experimental Setup and Theoretical CalculationsJordan Journal of Mechanical and Industrial EngineeringSolid Mechanics, Stress Analysis2019  Visit URL
Numerical Investigation of the Free Vibration of Partially Clamped Rectangular PlatesInternational Journal of Applied Mechanics and EngineeringApplied Mechanics, Plate Vibration2018  Visit URL
Finite element model updating of board-level electronic packages by factorial analysis and modalMicroelectronics InternationalVibrations, Finite Element Analysis, Applied Mechanics2018  Visit URL
Vibrations Analysis of Rectangular Plates with Clamped CornersOpen EngineeringApplied Mechanics, Vibration, Elastic Plates2018  Visit URL
Analytical model for the transient analysis of electronic assemblies subjected to impact loadingMicroelectronics ReliabilityApplied Mechanics, Impact Loading, Reliability Analysis2018  Visit URL
Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance TrackingASME Journal of electronic PackagingApplied Mechanics, Measurement Techniques2018  Visit URL
Electrochemical Performance of MnO2 for Energy Storage Supercapacitors in Solid-State DesignInternational Journal of Renewable Energy Research (IJRER)Energy Storage2018  Visit URL
Vibration analysis of rectangular plates resting on four rigid supportsWorld Journal of EngineeringSolid Mechanics, Plate Vibration2018  Visit URL
Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approachSoldering & Surface Mount TechnologyVibrations, Reliability Assessement, Applied Mechanics2018  Visit URL
Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodologyMicroelectronics ReliabilityVibrations, Reliability Assessement, Applied Mechanics2018  Visit URL
Solid-state supercapacitors with ionic liquid gel polymer electrolyte and polypyrrole electrodes for electrical energy storageJournal of Energy StorageEnergy Storage2017  Visit URL
A Pair of Partially Coupled Beams Subjected to Concentrated ForceIEEE Transactions on Components, Packaging and Manufacturing TechnologyApplied Mechanics2017  Visit URL
Analytical Solution for Electronic Assemblies Under VibrationJournal of Electronic PackagingApplied Mechanics, Vibration2016  Visit URL
Pad Cratering: Reliability of Assembly Level and Joint LevelJordan Journal of Mechanical and Industrial Engineering Engineering Mechanics and Materials2016  Visit URL
Stress concentration analysis for countersunk rivet holes in orthotropic platesEuropean Journal of Mechanics - A/SolidsِApplied Mechanics, Stress Concentration2013  Visit URL
A modified equation for the stress concentration factor in countersunk holesEuropean Journal of Mechanics - A/SolidsِApplied Mechanics, Stress Concentration2012  Visit URL