Research Title | MAG. TITLE | RESEARCH AREA | PUBLISH YEAR | DOI | Journal URL |
An Optimized Hybrid Finite Element Analyses - Artificial Neural Networks Technique for Estimating In-Plane Orthotropic Mechanical Properties in Printed Circuit Boards | Results in Engineering | Vibrations, Stress Analysis, Electronic Assemblies | 2024 | |
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A study on the thermomechanical response of various die attach metallic materials of power electronics | Soldering & Surface Mount Technology | Themomechanical Behavior, Solid mechanics, Materials Science | 2024 | |
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Modeling, analysis and forecasting of the Jordan’s transportation sector energy consumption using artificial neural networks | Environment, Development and Sustainability | Energy Demand Analysis, Sustainability, Artificial Neural Networks | 2024 | |
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A Study on the Fuel Consumption Demands of the Jordanian Residential Sector | Jordan Journal of Mechanical and Industrial Engineering | Energy demand analysis | 2024 | |
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Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds | Microelectronics Reliability | Creep mechanics, solid mechanics, stress analysis | 2024 | |
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An artificial intelligence-based approach for identifying the in-plane orthotropic mechanical properties of electronic circuit boards | The Journal of Strain Analysis for Engineering Design | Mechanics of Materials, Artificial Intelligence Applications | 2024 | |
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Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing | Soldering & Surface Mount Technology, | Solid Mechanics, Stress and Strain Analysis | 2024 | |
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Research on the creep response of lead-free die attachments in power electronics | International Journal of Structural Integrity | Solid Mechanics, Stress Analysis, Materials Science | 2024 | |
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Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100°C | Welding International | Solid Mechanics, Stress and Strain Analysis, FEA. | 2024 | |
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Analysis and future projections of the electricity demands of the Jordanian household sector using artificial neural networks | Journal of Science and Technology Policy Management | Sustainability, Artificial Intelligence and Energy Analysis | 2024 | |
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Artificial Neural Networks Modeling of the Electricity Demands in the Jordanian Industrial Sector | Jordan Journal of Mechanical and Industrial Engineering | Energy Demand Analysis, Artificial Neural Networks | 2024 | |
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A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration | Microelectronics International | Vibrations, Stress Analysis, Electronic Assemblies | 2023 | |
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Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents | Soldering & Surface Mount Technology | Solid Mechanics, Materials Science | 2023 | |
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Analytical Evaluation of Solder Stress in Electronic Packages Subjected to Random Vibrations | Mathematical Modelling of Engineering Problems | Random Vibrations, Solid Mechanics | 2023 | |
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Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models | IEEE Transactions on Components, Packaging and Manufacturing Technology | Creep mechanics, solid mechanics, stress analysis | 2023 | |
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Numerical Characterization of the Mechanical Performance of SAC105 Tin-Silver-Copper Solder Interconnections After Aging | Annales de Chimie - Science des Matériaux | Solid Mechanics, Thermal Stresses | 2023 | |
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Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders | Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications | Solid Mechanics, Thermal Stresses | 2023 | |
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Investigating and Predicting the Effects of Fiber Chemical Composition and Treatment on the Mechanical Properties of Natural Fiber Composites by Response Surface Method | Mathematical Modelling of Engineering Problems | Composite Materials, Solid Mechanics | 2023 | |
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Drop and impact reliability investigation of BGA and LGA interconnects | Soldering & Surface Mount Technology, | Solid Mechanics, Stress and Strain Analysis | 2023 | |
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Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics | The Journal of Strain Analysis for Engineering Design | Materials Science, Creep of Metals, Solid Mechanics | 2023 | |
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An efficient equivalent static methodology for simulating electronic packages subjected to resonant vibrations | Microelectronics Reliability | Solid Mechanics, Stress Analysis, Vibrations | 2023 | |
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Numerical Solution for Electronic Assemblies Subjected to Mechanical Bending | Mathematical Modelling of Engineering Problems | Solid Mechanics, Stress Analysis, Numerical Approach | 2022 | |
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Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study | Journal of the Mechanical Behavior of Materials | Solid Mechanics, and Mechanics of Materials | 2022 | |
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A High-Accuracy Empirical Formula for the Strain Concentration Factor in Countersunk Holes | Mathematical Modelling of Engineering Problems | Stress and Strain Analysis, Solid Mechanics | 2022 | |
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A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact | Microelectronics Reliability | Solid Mechanics, Mechanical Vibrations and Impact Loading | 2022 | |
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Numerical Solution for the Mechanical Bending of Two Elastically Coupled Plates Problem | Mathematical Modelling of Engineering Problems | Stress and Strain Analysis, Solid Mechanics | 2022 | |
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An Accuracy and Efficiency Study on the Use of Symmetrical Numerical Models of Electronic Packages under Various Loading Conditions | Jordan Journal of Mechanical and Industrial Engineering | Computational Mechanics | 2022 | |
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Identification of printed circuit boards mechanical properties using response surface methods | Microelectronics International | Mechanics, Material Characterization, Measurements | 2021 | |
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Finite Element Analysis on the Thermal Fatigue Life of Full vs. Peripheral Array Packages | Multidiscipline Modeling in Materials and Structures | Solid Mechanics, Stress and Strain Analysis | 2021 | |
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Stress concentration factor analysis of countersunk holes using finite element analysis and response surface methodology | Australian Journal of Mechanical Engineering | Stress Concentrations, Finite Element Method, Solid Mechanics | 2021 | |
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A simulation-based study on the effect of package parameters on the random vibration behavior of electronic packages | The European Physical Journal Plus | Solid Mechanics, and Random Vibrations | 2021 | |
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Optimization of Dwell and Ramp Times for SAC305 Solder Thermal Cycling Fatigue Life for Testing and Real-Life Applications | Journal of Failure Analysis and Prevention | Solid Mechanics, Stress Analysis | 2021 | |
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A numerical analysis on the effect of point-support methods on the fatigue performance of thermally cycled electronic assemblies | Microelectronics Reliability | Solid Mechanics, Thermal Stresses | 2021 | |
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Analysis, formulation, and optimisation of the strain concentration factor in double countersunk holes due to uniaxial tension | Australian Journal of Mechanical Engineering | Applied Mechanics, Finite Element Analysis | 2020 | |
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A Study on the Stress Concentration Factor Induced in Double Countersunk Holes Due to Uniaxial Tension | International Journal of Applied Mechanics and Engineering | Solid Mechanics, Stress and Strain Analysis | 2020 | |
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A numerical study on the effect of the fixation methods on the vibration fatigue of electronic packages | Microelectronics Reliability | Solid Mechanics, Shock and Vibration | 2020 | |
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Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings | Soldering & Surface Mount Technology | Material Failure, Solid Mechanics, Shock and Vibration | 2020 | |
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Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method | Microelectronics Reliability | Solid Mechanics, Random Vibration | 2019 | |
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Three-Material Beam: Experimental Setup and Theoretical Calculations | Jordan Journal of Mechanical and Industrial Engineering | Solid Mechanics, Stress Analysis | 2019 | |
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Numerical Investigation of the Free Vibration of Partially Clamped Rectangular Plates | International Journal of Applied Mechanics and Engineering | Applied Mechanics, Plate Vibration | 2018 | |
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Finite element model updating of board-level electronic packages by factorial analysis and modal | Microelectronics International | Vibrations, Finite Element Analysis, Applied Mechanics | 2018 | |
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Vibrations Analysis of Rectangular Plates with Clamped Corners | Open Engineering | Applied Mechanics, Vibration, Elastic Plates | 2018 | |
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Analytical model for the transient analysis of electronic assemblies subjected to impact loading | Microelectronics Reliability | Applied Mechanics, Impact Loading, Reliability Analysis | 2018 | |
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Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking | ASME Journal of electronic Packaging | Applied Mechanics, Measurement Techniques | 2018 | |
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Electrochemical Performance of MnO2 for Energy Storage Supercapacitors in Solid-State Design | International Journal of Renewable Energy Research (IJRER) | Energy Storage | 2018 | |
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Vibration analysis of rectangular plates resting on four rigid supports | World Journal of Engineering | Solid Mechanics, Plate Vibration | 2018 | |
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Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach | Soldering & Surface Mount Technology | Vibrations, Reliability Assessement, Applied Mechanics | 2018 | |
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Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology | Microelectronics Reliability | Vibrations, Reliability Assessement, Applied Mechanics | 2018 | |
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Solid-state supercapacitors with ionic liquid gel polymer electrolyte and polypyrrole electrodes for electrical energy storage | Journal of Energy Storage | Energy Storage | 2017 | |
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A Pair of Partially Coupled Beams Subjected to Concentrated Force | IEEE Transactions on Components, Packaging and Manufacturing Technology | Applied Mechanics | 2017 | |
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Analytical Solution for Electronic Assemblies Under Vibration | Journal of Electronic Packaging | Applied Mechanics, Vibration | 2016 | |
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Pad Cratering: Reliability of Assembly Level and Joint Level | Jordan Journal of Mechanical and Industrial Engineering | Engineering Mechanics and Materials | 2016 | |
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Stress concentration analysis for countersunk rivet holes in orthotropic plates | European Journal of Mechanics - A/Solids | ِApplied Mechanics, Stress Concentration | 2013 | |
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A modified equation for the stress concentration factor in countersunk holes | European Journal of Mechanics - A/Solids | ِApplied Mechanics, Stress Concentration | 2012 | |
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