الأوراق العلمية | السنة | إسم المؤتمر | الرابط الالكتروني |
Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking | 2014 | IEEE Electronic Components and Technology Conference |
زيارة الرابط
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Board-Level Drop Test: Comparison of Two ANSYS Modeling Approaches and Correlation with Testing | 2013 | Advanced Research in Electronics Assembly (AREA) Consortium |
زيارة الرابط
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Modeling and Characterization for Vibration | 2013 | Advanced Research in Electronics Assembly (AREA) Consortium |
زيارة الرابط
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Strain Correlation: Finite Element Modeling and Experimental Data | 2013 | Advanced Research in Electronics Assembly (AREA) Consortium |
زيارة الرابط
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LGAs VS. BGAs – LOWER PROFILE AND BETTER RELIABILITY | 2012 | SMTA International Conference |
زيارة الرابط
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