| الأوراق العلمية | السنة | إسم المؤتمر | الرابط الالكتروني |
| Modular Containerization of Parcel Logistics Networks: Simulation-Based Impact Assessment | 2023 | IPIC 2023 - 9th International Physical Internet Conference |
زيارة الرابط
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| Effect of Surface Finish and High Bi solder Alloy on Component Reliability in Thermal Cycling | 2018 | Electronic Components and Technology Conference (ECTC) |
زيارة الرابط
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